0

R2

-10

R1

C

-20

C

-30

-40

d

-50

600

800

1000

1200

1400

Frequency ( GHz)

(a)

(b)

Figure 2. (a) Split ring resonator geometry and dimensional parameters after Marqués [14], (b) frequency response of

SRR with center at 1 THz.

To achieve 1 THz operation , the SRR was dimensioned with parameters summarized in Table 1.

Table 1. Simulation parameters for geometry in figure 2a, with inner radius (IR), outer radius (OR), and metal thickness

( z ).

IR

OR

z

micron

micron

micron

60

90

20

Inner ring

110

140

20

Outer ring

30

micron

C

20

micron

d

In this design, the structure is fabricated on a two-metal substrate, with metal 1 supplying input and ground

connections, and metal 2 providing ring material, as depicted in figure 3. Choice of fabrication substrates include printed

circuit board and semiconductor substrate. While a PCB substrate offers a robust option, smaller geometries and critical

dimensions may be reproduced with tighter tolerances on a wafer substrate. The objective is to print the array with

precision in ring dimensions to achieve the desired resonant frequency and Q, and precision in metal 1 traces so that

array resonates in unison. Ultimately, the choice of substrate is determined by customer specifications; lower

frequencies with wavelengths in the millimeters may be obtained on PCB.