Latest Enhancements in XFdtd
Current Version: Release 7.5.1
Remcom continues our tradition of customer-responsive design with XFdtd Release 7.5.
- We identified a bottleneck in the processes of our customers working on mobile device design, and created a new add-on module that simplifies and speeds the process of matching the antenna. The Circuit Element Optimizer is an industry first and promises to transform antenna matching circuit applications.
- We have introduced a new electrostatic solver for XFdtd. The electrostatic solver enables the use of XF’s Capacitance Matrix Simulation, a critical feature for designing electronics with Touchscreen Panel (TSP) technology.
Read on to learn how XF 7.5's new features will speed your processes and assist your company in releasing products to the market faster.
Circuit Element Optimizer
Initially designed for matching circuit optimization, the Circuit Element Optimizer determines optimal component values while considering the multitude of EM effects on the real circuit’s physical layout.
Using XF’s full wave FDTD solver, the optimizer is able to take the following EM effects into account:
System efficiency, radiation efficiency, and S-parameters are used as the goal function to determine the final component values.
Electrostatic Solver with Capacitance Matrices
Remcom’s Electrostatic Solver has been enhanced to increase its accuracy and expand the applications for which it can be used. The Electrostatic Solver utilizes the XF user interface and is available as a stand-alone product or as an add-on to XF.
Optenni Lab Integration
Data from XF can be directly transferred to Optenni Lab through the Results Browser. Optenni Lab is a software package that synthesizes and optimizes matching network topologies and component values based on S-Parameter and efficiency results from an XF simulation. Included in this integration is the ability to:
Three Pole Debye/Drude Material on XStream
The GPU kernel has been updated to support dispersive three pole Debye/Drude material equations (previously only the single pole representation was supported). This update allows simulations containing the three pole Debye/Drude material type to utilize the speedups from GPU hardware. Identical to non-dispersive materials, users can specify the number of GPUs to utilize through the Queue dropdown in the Simulations window.
Softkill Termination for Timestepping
An FDTD simulation proceeds through the following stages: initialization, timestepping, steady state post processing, and writing output. The softkill feature allows the user to terminate the timestepping stage of a simulation and proceed to the steady state post processing.
Through the UI, timestepping can be terminated by right clicking on the simulation in the Simulations window and choosing Stop | End Simulation Gracefully.
Alternatively, create a file named project.softkill in the *.xf/Simulations/### directory to kill a simulation or create the file in …/Simulations/###/Run### to kill the run, but continue the simulation.
Time Dependent Material
A new material type has been added to XF that allows a user to specify a material’s permittivity and conductivity as a function of time. The inputs can be specified as a constant value, loaded from a file, or entered as an equation. As the timestepping stage of a simulation proceeds through time, the material properties will be modified accordingly.