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    Video Tour: Introduction to XFdtd's Transient EM/Circuit Co-Simulation Capability

    Simulate TVS diodes and resolve ESD vulnerabilities earlier in the design process.

    Video Tour Introduction to XFdtd Transient EM Circuit Co-Simulation Capability

    Damage due to electrostatic discharge (ESD) poses a high threat to device safety and reliability. XFdtd contains a number of features for simulating the ESD testing process, allowing engineers to pinpoint components susceptible to ESD damage and optimize ESD mitigation prior to trial-and-error testing on a physical prototype.

    In particular, XF's unique capability for simulating TVS diodes empowers engineers to finalize protection circuitry for their products in the early stages of design, improving product reliability and lowering costs by reducing the design engineering cycle time.

    The following video tour steps through this important feature and how it is utilized in XF to preemptively resolve ESD vulnerabilities and prevent future certification setbacks.